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Freescale Semiconductor, Inc.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order number: MPX5100/D Rev 9, 3/2004
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5100/MPXV5100 series piezoresistive transducer is a state-ofthe-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
MPX5100/MPXV5100 SERIES
INTEGRATED PRESSURE SENSOR
Differential Absolute 0 to 100 kPa (0 to 14.5 psi) 15 to 115 kPa (2.18 to 16.68 psi) 0.2 to 4.7 Volts Output
SMALL OUTLINE PACKAGE UNIBODY PACKAGE
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Features
* * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configurations Ideal for Automotive and Non-Automotive Applications
VS
MPX5100D
CASE 867
MPXV5100GC6U
CASE 482A
MPX5100DP
CASE 867C THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
SENSING ELEMENT
MPXV5100GC7U
Vout CASE 482C
GND
PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE PINS 4, 5, AND 6 ARE NO CONNECTS FOR UNIBODY PACKAGE 1 2 3 4
MPX5100GSX
CASE 867F
PIN NUMBER
N/C VS GND Vout 5 6 7 8 N/C N/C N/C N/C 1 2 3
PIN NUMBER
Vout GND VS 4 5 6 N/C N/C N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.
NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.
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MPX5100/MPXV5100 SERIES Table 1. MAXIMUM RATINGS(NOTE)
Rating
Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature
Symbol
Pmax Tstg TA
Value
400 -40 to +125 -40 to +125
Unit
kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic
Pressure Range Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A
(1)
Symbol
POP VS Io Voff VFSO VFSS -- V/P
Min
0 15 4.75 -- 0.088 4.587 -- -- -- -- -- -- --
Typ
-- -- 5.0 7.0 0.20 4.700 4.500 -- 45 1.0 0.1 20 0.5
Max
100 115 5.25 10 0.313 4.813 -- 2.5 -- -- -- -- --
Unit
kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
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Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85C)
Full Scale Output(4) Differential and Absolute (0 to 85C) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time
(7)
Differential and Absolute (0 to 85C)
tR Io+ -- --
Output Source Current at Full Scale Output Warm-Up Time Offset
1. 2. 3. 4. 5. 6.
(8)
Stability(9)
NOTES:
7. 8. 9.
1.0kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. MECHANICAL CHARACTERISTICS
Characteristics
Weight, Basic Element (Case 867) Weight, Basic Element (Case 482)
Typ
4.0 1.5
Unit
grams grams
2
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MPX5100/MPXV5100 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5100/MPXV5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 1.
Transfer Function MPX5100D/MPX5100G/MPXV5100G Series 5 Vout = VS x (0.009 x P + 0.04) (Pressure Error x Temperature Factor x 0.009 x VS) VS = 5.0 V 0.25 Vdc PE = 2.5 TM = 1 Temperature = 0-85C
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OUTPUT VOLTAGE (V)
3 TYPICAL 2 MAX MIN 1
0 0 10 20 30 40 50 60 70 80 90 100 110 PRESSURE (kPa) OFFSET (TYP)
Figure 2. Output versus Pressure Differential
FLUORO SILICONE GEL DIE COAT WIRE BOND STAINLESS STEEL METAL COVER FLUORO SILICONE GEL DIE COAT STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE
DIE
DIE
EPOXY PLASTIC WIRE BOND CASE
LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT
DIE BOND
LEAD FRAME ABSOLUTE ELEMENT
OUTPUT RANGE (TYP)
4
SPAN RANGE (TYP)
DIE BOND
Figure 3. Cross-Sectional Diagrams (Not to Scale)
+5 V Vout VS IPS 1.0 F 0.01 F GND 470 pF OUTPUT
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646)
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MPX5100/MPXV5100 SERIES
Transfer Function (MPX5100D, MPX5100G, MPXV5100G)
Nominal Transfer Value: Vout = VS (P x 0.009 + 0.04) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 5% P kPa
Temperature Error Multiplier
MPX5100D/MPX5100G/MPXV5100G Series
4.0 3.0 Temp Multiplier -40 3 0 to 85 1 +125 3
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2.0 1.0 0.0 -40 -20 0 20 40 60 80 Temperature in C 100 120 130 140
NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 0
Pressure in kPa 20 40 60 80 100 120
Pressure 0 to 100 kPa
Error (max) 2.5 kPa
4
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MPX5100/MPXV5100 SERIES Transfer Function (MPX5100A)
Nominal Transfer Value: Vout = VS (P x 0.009 - 0.095) (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 5% P kPa
Temperature Error Multiplier
MPX5100A Series
4.0 3.0 Temp Multiplier -40 3 0 to 85 1 +125 3
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2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
MPX5100A Series
Error Limits for Pressure
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 0 20
Pressure in kPa 40 60 80 100 130
Pressure 15 to 115 kPa
Error (max) 2.5 kPa
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MPX5100/MPXV5100 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor Part Number MPX5100A, MPX5100D MPX5100DP MPX5100AP, MPX5100GP MPX5100GSX MPXV5100GC6U MPXV5100GC7U is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the Table below: Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached
Case Type 867 867C 867B 867F 482A 482C
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ORDERING INFORMATION
The MPX5100/MPXV5100 pressure sensor is available in absolute, differential, gauge, and vacuum configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure connections.
Device Name Basic Element Ported Elements Absolute Differential Differential Dual Ports Absolute, Single Port Gauge, Single Port Gauge, Axial PC Mount Gauge, Axial Port, SMT Gauge, Axial Port, DIP Options Case Type 867 867 867C 867B 867B 867F 482A 482C MPX Series Order Number MPX5100A MPX5100D MPX5100DP MPX5100AP MPX5100GP MPX5100GSX MPXV5100GC6U MPXV5100GC7U Device Marking MPX5100A MPX5100D MPX5100DP MPX5100AP MPX5100GP MPX5100D MPXV5100G MPXV5100G
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint,
0.660 16.76
the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
6
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MPX5100/MPXV5100 SERIES
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
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TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N
BASIC ELEMENT
T R
SEATING PLANE
A U L V Q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
DIM A B C D F G J K L N P Q R S U V MILLIMETERS MAX MIN 29.85 29.08 18.16 17.4 8.26 7.75 0.84 0.68 1.63 1.22 2.54 BSC 0.41 0.36 18.42 17.65 7.62 7.37 11.18 10.67 4.04 3.89 4.04 3.89 6.35 5.84 6.1 5.59 23.11 BSC 4.93 4.62
N Q B
1 2 34 5 6
K P C J 0.25
M PIN 1
S G
6X
P TQ
M
F
D 0.173
M
TP
S
Q
S
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
PRESSURE SIDE PORTED (AP, GP)
CASE 867B-04 ISSUE F CASE 867B-04 ISSUE F
DATE 09/20/99
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MPX5100/MPXV5100 SERIES
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)
M
TQ
M
-AU W L V
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
PORT #2 VACUUM (P2)
N
PORT #1 POSITIVE PRESSURE (P1)
-QB
PIN 1
1
2
3
4
5
6
K S
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C
SEATING PLANE
DIM A B C D F G J K L N P Q R S U V W X
-T-
-TJ
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
CASE ISSUE F 876C-05 ISSUE F
CASE 867C-05
DATE 12/12/96
PRESSURE AND VACUUM SIDES PORTED (DP)
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
V
N B R
PORT #1 POSITIVE PRESSURE (P1)
PIN 1
-P0.25 (0.010)
M
TQ
M
6
5
4
3
2
1
S K J 0.13 (0.005)
M
TP
S
D 6 PL QS F
G
VOUT GROUND VCC V1 V2 VEX
CASE 867F-03 CASE 867F-03 ISSUE D
ISSUE D
DATE 12/12/96
PRESSURE SIDE AXIAL PORT (GSX)
8
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MPX5100/MPXV5100 SERIES
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C
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H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 CASE 482A-01 ISSUE A
ISSUE A
SMALL OUTLINE PACKAGE SURFACE MOUNT
DATE 05/13/98
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.500 0.520 12.70 13.21 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0 15 0 15 0.444 0.448 11.28 11.38 0.540 0.560 13.72 14.22 0.245 0.255 6.22 6.48 0.115 0.125 2.92 3.17
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B ISSUE B
CASE 482C-03
SMALL OUTLINE PACKAGE THROUGH-HOLE
DATE 06/12/98
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NOTES
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NOTES
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. (c) Motorola, Inc. 2004
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